Study of interfacial reactions between lead-free solders and immersion silver finish

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Study of interfacial reactions between lead-free solders and immersion silver finish

Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for...

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Bibliographic Details
Main Author:	Oshaghi, Safoura
Format:	Thesis
Language:	English
Published:	2008
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/9546/ http://eprints.utm.my/9546/1/SafouraOshaghiMFKM2008.pdf

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