Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method

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Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method

Coefficient of thermal expansion (CTE) mismatch between the different material layers in the substrate leads to residual warpage and stresses. Such deformation adds additional mechanical constraints to solder joint attached on the surface of substrate and subsequently leads to solder joint reliabili...

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Bibliographic Details
Main Author:	Pang, Hooi San
Format:	Thesis
Language:	English
Published:	2007
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/9444/ http://eprints.utm.my/9444/1/PangHooiSanMFKM2007.pdf

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