APA (7th ed.) Citation

Pang, H. S. (2007). Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method.

Chicago Style (17th ed.) Citation

Pang, Hooi San. Development of Low Coefficient of Thermal Expansion Composite Substrate for Electronic Packaging Using Finite Element Method. 2007.

MLA (9th ed.) Citation

Pang, Hooi San. Development of Low Coefficient of Thermal Expansion Composite Substrate for Electronic Packaging Using Finite Element Method. 2007.

Warning: These citations may not always be 100% accurate.