Numerical simulation of a microchip cooling wth microjet array

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Numerical simulation of a microchip cooling wth microjet array

The increasing demand for a more powerful microchip has projected power dissipation for high performance processor up to 300 Watts in 2018. With the dimensions expected to remain at 310 mm2, the heat density approaches the limit of conventional cooling methods. Microjet impingement cooling is a pot...

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Bibliographic Details
Main Authors:	Yeo, Eng Soon, Mohd. Ghazali, Normah
Format:	Article
Language:	English
Published:	Faculty of Mechanical Engineering 2008
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/8735/ http://eprints.utm.my/8735/3/YeoEngSoon2008_NumericalSimulationofaMicrochipCooling.pdf

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