Simulating damage mechanics of electromigration and thermomigration

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Simulating damage mechanics of electromigration and thermomigration

Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issues for next generation nanoelectronics and power electronics. The purpose of this project is to develop a computational tool for simulating damage mechanics of EM and TM and their intera...

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Bibliographic Details
Main Authors:	Shidong, Li, Abdul Hamid, Mohd. F., Basaran, Cemal
Format:	Article
Published:	Society for Computer Simulation International, San Diego, Ca., USA 2008
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/8602/

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