Thermomigration in lead-free solder joints

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Thermomigration in lead-free solder joints

In the next generation nanoelectronics and SiC based electronic packaging, current density and temperature gradient will be larger in orders of magnitude. Electromigration and thermomigration are considered to be major road blocks leading to realisation of nanoelectronics and SiC based high tempera...

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Bibliographic Details
Main Authors:	Abdul Hamid, M. F, S., Li, Basaran, C.
Format:	Article
Published:	Inderscience Publishers 2008
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/8493/

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