Thermomigration induced degradation in solder alloys

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Thermomigration induced degradation in solder alloys

Miniaturization of electronics to the nanoscale brings new challenges. Because of their small size and immense information and power processing capacity, large temperature gradients exist across nanoelectronics and power electronics solder joints. In this paper, a fully coupled thermomechanical-diff...

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Bibliographic Details
Main Authors:	Basaran, C., Li, S., Abdul Hamid, M. F.
Format:	Article
Language:	English
Published:	State University of New York at Buffalo, USA 2008
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/8489/ http://eprints.utm.my/8489/3/CemalBasaran2008_ThermomigrationInducedDegradationInSolder.pdf

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