Substrate Warpage analysis During Solger Reflow Process

QR Code

Substrate Warpage analysis During Solger Reflow Process

Organic substrate is a composite panel consists of several materials such as BT core, copper, dielectric, solder resist and plugging material. As different material has different material property, when the organic substrate is exposed to thermal excursion in the manufacturing process, the substr...

Full description

Bibliographic Details
Main Author:	Beh, Keh Shin
Format:	Thesis
Published:	2004
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/6938/

Similar Items

Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process
by: Raja Gobal, Hehgeraj
Published: (2022)

Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process
by: Muhammad Rafiq, Mohammad Sabri
Published: (2018)

Experiment And Simulation Reflow Process Of PDMS Material
by: Go, How Chiang
Published: (2017)

Optimization of warpage defect in injection moulding process using ABS material
by: Ahmad, Asnul Hadi, et al.
Published: (2009)

Study Of Crack Propagation On Component (Multilayer Ceramic Capacitor) During Reflow Soldering Process
by: Azman, Muhammad Aliff Zikri
Published: (2021)

Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering
by: Chong, Jia Jun
Published: (2019)

Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2011)

Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
by: Tan, Ai Ting
Published: (2017)

Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2016)

Warpage Optimisation on the Moulded Part using Response Surface Methodology (RSM) and Glowworm Swarm Optimisation (GSO)
by: M. H. M., Hazwan, et al.
Published: (2017)

Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
by: Abu Hassan, Nurfazlin
Published: (2009)

Warpage analysis on thick shell part using response surface methodology (RSM) and bat algorithm (BA) to optimize parameter setting in injection molding process
by: Ch'Ng, S. Q., et al.
Published: (2018)

A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering
by: M. H., Mohd Zaki, et al.
Published: (2023)

Warpage Optimisation on the Moulded Part with Conformal Cooling Channels using Response Surface Methodology (RSM) and Glowworm Swarm Optimisation (GSO)
by: M. H. M., Hazwan, et al.
Published: (2017)

Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)

Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape
by: Lim, Shaw Fa
Published: (2020)

Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)

Optimization parameters to reduce the warpage defect of plastic injection molding process for a thin-shell part using design of experiment
by: Radhwan, H., et al.
Published: (2019)

Effect of carburization process on adhesion strength of ti carbide layer on titanium alloy substrate
by: Sudin, Izman, et al.
Published: (2011)

Two Dimensional (2d) Nanofabrication Process On Quartz Substrate
by: Shamsuddin, Nur Liyana Mohd
Published: (2016)

Experimental Analysis on Martensite Formation of Low Carbon Steel During Rapid Cooling Process
by: Mohd Zaidi, Sidek, et al.
Published: (2013)

Adhesion Properties of Metallic Coatings on Mild Steel Substrates
by: Amir, N., et al.
Published: (2008)

Antenna Array Bandwidth Enhancement using Polymeric Nanocomposite Substrate
by: W. A. W., Muhamad, et al.
Published: (2016)

Effect of Parameter Controlled in Tin Coating on the Mild Steel Substrate
by: Yaakob, Mohd Yuhazri, et al.
Published: (2011)

Coating Effect Condition on the Corrosion Properties of Mild Steel Substrate
by: Y., Mohd Yuhazri, et al.
Published: (2011)

Friction-Stir Processing of a Cold Sprayed AA7075 Coating Layer on the AZ31B Substrate: Structural Homogeneity, Microstructures and Hardness
by: Khodabakhshi, F., et al.
Published: (2017)

Nanoindentation Of Copper Thin Film On Silicon Substrates
by: Zalkapli, Muhammad Amir
Published: (2022)

Full-Wave Analysis Of Air-Filled Substrate Integrated Waveguide
by: Zubir, Ahmad Ikhwan Mohd
Published: (2021)

Neodymium oxide thin film gate oxide on silicon substrate / Hetherin Karuppiah
by: Hetherin , Karuppiah
Published: (2018)

Dual-Band Wearable Fluidic Antenna With Metasurface Embedded In A PDMS Substrate
by: Muhammad Nazrin, Ramli, et al.
Published: (2017)

Thermal oxidation and hydroxyapatite coating of SLMed 316L stainless steel substrates
by: Rahil Izzati, Mohd Asri
Published: (2018)

Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
by: M.A., Rabiatul Adawiyah, et al.
Published: (2020)

Implications Of Intravascular Catheter In A Blood Vessel During Medical Treatment Using Computational Fluid Dynamics
by: Chong, Shin Yun
Published: (2021)

Identifying Bifurcation Behavior during Machining Process for an Irregular Milling Tool Geometry
by: A. R., Yusoff
Published: (2016)

Nano-structured diamond & silica coatings on CO-CR-MO substrate for biomedical application
by: Kumaran, Kadirgama, et al.

A wideband reconfigurable folded planar dipole using MEMS and hybrid polymeric substrates
by: H., Lago, et al.
Published: (2019)

Laser surface treatment of porous ceramic substrate for application in solid oxide fuel cells
by: Dayang Salyani, Mahmod, et al.
Published: (2016)

A review on the morphology of daimond thin film coating on various types of substrate materials
by: Hamzah, Esah, et al.
Published: (2006)

Development Of Micro Heating Element By Optical Lithography On Alumina Substrate
by: Tan, Teong Sheng
Published: (2017)

Design And Optimization Of Transition For Air-Filled Substrate Integrated Waveguide
by: Mansor, Nur Hidayah
Published: (2018)