Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine

The fast growing packaging industry in South-East Asia has provided a great potential for the use of cylinder copper plating machines for printing. The purpose of this project is to design and develop a prototype of an automated fully immersion cylinder copper plating machine capable of functioni...

Full description

Bibliographic Details
Main Author: Ariyono, Sugeng
Format: Thesis
Published: 2000
Subjects:
Online Access:http://eprints.utm.my/6928/
_version_ 1848891372304596992
author Ariyono, Sugeng
author_facet Ariyono, Sugeng
author_sort Ariyono, Sugeng
building UTeM Institutional Repository
collection Online Access
description The fast growing packaging industry in South-East Asia has provided a great potential for the use of cylinder copper plating machines for printing. The purpose of this project is to design and develop a prototype of an automated fully immersion cylinder copper plating machine capable of functioning at optimum parameters automatically and thus achive enhanced print quality. The development also includes minimising the set-up process and facilitates maintenance by designing leakage blocks and built-in module respectively. Complexity of the plating parameters needed in the gravure industry could have significant influence on the plating process and quality of end product. In this research work the effect of linear cylinder speed and cathode-anode distance on the copper plating efficiency, deposit structure, and hardness has been investigated. The results showed that maximum plating efficiency is affected by both cylinder linear speed and cathode-anode distance. Within the low range of linear speed covered (40 to 105 m/min), the maximum efficiency is achieved for small cathode-anode distance (2 cm). At high linear speeds (106 to 133 m/min), however, the maximum efficiency was observed to occur at higher cathode-anode distance (4 cm). This increase in efficinecy appears to be triggered by agitation in the electrolyte solution. Metallurgical examination revealed that the maximum plating efficiency is associated with finer structures and higher hardness valu
first_indexed 2025-11-15T20:56:55Z
format Thesis
id utm-6928
institution Universiti Teknologi Malaysia
institution_category Local University
last_indexed 2025-11-15T20:56:55Z
publishDate 2000
recordtype eprints
repository_type Digital Repository
spelling utm-69282011-01-23T12:15:18Z http://eprints.utm.my/6928/ Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine Ariyono, Sugeng TJ Mechanical engineering and machinery The fast growing packaging industry in South-East Asia has provided a great potential for the use of cylinder copper plating machines for printing. The purpose of this project is to design and develop a prototype of an automated fully immersion cylinder copper plating machine capable of functioning at optimum parameters automatically and thus achive enhanced print quality. The development also includes minimising the set-up process and facilitates maintenance by designing leakage blocks and built-in module respectively. Complexity of the plating parameters needed in the gravure industry could have significant influence on the plating process and quality of end product. In this research work the effect of linear cylinder speed and cathode-anode distance on the copper plating efficiency, deposit structure, and hardness has been investigated. The results showed that maximum plating efficiency is affected by both cylinder linear speed and cathode-anode distance. Within the low range of linear speed covered (40 to 105 m/min), the maximum efficiency is achieved for small cathode-anode distance (2 cm). At high linear speeds (106 to 133 m/min), however, the maximum efficiency was observed to occur at higher cathode-anode distance (4 cm). This increase in efficinecy appears to be triggered by agitation in the electrolyte solution. Metallurgical examination revealed that the maximum plating efficiency is associated with finer structures and higher hardness valu 2000 Thesis NonPeerReviewed Ariyono, Sugeng (2000) Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine. Masters thesis, Universiti Teknologi Malaysia, Mechanical Engineering. http://sps.utm.my
spellingShingle TJ Mechanical engineering and machinery
Ariyono, Sugeng
Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_full Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_fullStr Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_full_unstemmed Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_short Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_sort optimisation of gravure cylinder plating by designing and fabricating the cylinder copper plating machine
topic TJ Mechanical engineering and machinery
url http://eprints.utm.my/6928/
http://eprints.utm.my/6928/