An experimental investigation on partial-ductile mode grinding of silicon

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An experimental investigation on partial-ductile mode grinding of silicon

This research work was primarily concentrated on precise ductile-mode grinding (milling) of flat surfaces of silicon, mainly Integrated Circuit (IC) silicon chips (dies), which were about 700 Âµm thick and the top of their surfaces covered with a silicon nitride layer. Substantial amount of partial-...

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Bibliographic Details
Main Author:	Konneh, M.
Format:	Thesis
Language:	English
Published:	2002
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/6867/ http://eprints.utm.my/6867/1/MohamedKonnehPFKM2002_AnExperimentalInvestigationonPartial-DuctileModeGrinding.pdf

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