Venkatesh, V. C., & Izman, S. (2007). Development of a novel binderless diamond grinding wheel for machining IC chips for failure analysis. Elsevier B.V.
Chicago Style (17th ed.) CitationVenkatesh, V. C., and S. Izman. Development of a Novel Binderless Diamond Grinding Wheel for Machining IC Chips for Failure Analysis. Elsevier B.V, 2007.
MLA (9th ed.) CitationVenkatesh, V. C., and S. Izman. Development of a Novel Binderless Diamond Grinding Wheel for Machining IC Chips for Failure Analysis. Elsevier B.V, 2007.
Warning: These citations may not always be 100% accurate.