On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS)
This paper is on the geometrical effective thermal conductivity of hollow metal sphere structures. Two different technologies of joining, namely adhesive bonding and sintering, are considered. The spheres are arranged in the nodes of a cubic primitive lattice and connected by an adhesive layer, resp...
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| Format: | Article |
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Transtech Publications
2007
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| Online Access: | http://eprints.utm.my/5522/ |
| _version_ | 1848891073516011520 |
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| author | Fiedler, Thomas Ochsner, Andreas |
| author_facet | Fiedler, Thomas Ochsner, Andreas |
| author_sort | Fiedler, Thomas |
| building | UTeM Institutional Repository |
| collection | Online Access |
| description | This paper is on the geometrical effective thermal conductivity of hollow metal sphere structures. Two different technologies of joining, namely adhesive bonding and sintering, are considered. The spheres are arranged in the nodes of a cubic primitive lattice and connected by an adhesive layer, respectively directly joined by sintering. Furthermore, the influence of the cell wall thickness of the spheres on the thermal conductivity is investigated. |
| first_indexed | 2025-11-15T20:52:10Z |
| format | Article |
| id | utm-5522 |
| institution | Universiti Teknologi Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-15T20:52:10Z |
| publishDate | 2007 |
| publisher | Transtech Publications |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | utm-55222017-08-03T07:19:58Z http://eprints.utm.my/5522/ On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS) Fiedler, Thomas Ochsner, Andreas TJ Mechanical engineering and machinery This paper is on the geometrical effective thermal conductivity of hollow metal sphere structures. Two different technologies of joining, namely adhesive bonding and sintering, are considered. The spheres are arranged in the nodes of a cubic primitive lattice and connected by an adhesive layer, respectively directly joined by sintering. Furthermore, the influence of the cell wall thickness of the spheres on the thermal conductivity is investigated. Transtech Publications 2007 Article PeerReviewed Fiedler, Thomas and Ochsner, Andreas (2007) On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS). Materials Science Forum, 553 . pp. 39-44. ISSN 978-0-87849-438-5 http://www.scientific.net |
| spellingShingle | TJ Mechanical engineering and machinery Fiedler, Thomas Ochsner, Andreas On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS) |
| title | On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS)
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| title_full | On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS)
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| title_fullStr | On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS)
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| title_full_unstemmed | On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS)
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| title_short | On the thermal conductivity of adhesively bonded and sintered Hollow Sphere Structures (HSS)
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| title_sort | on the thermal conductivity of adhesively bonded and sintered hollow sphere structures (hss) |
| topic | TJ Mechanical engineering and machinery |
| url | http://eprints.utm.my/5522/ http://eprints.utm.my/5522/ |