A unified constitutive model for solder materials

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A unified constitutive model for solder materials

Solder joint reliability has been the main concern in electronic packaging since the advent of surface mount technology. In this study, a unified constitutive model was developed for finite element analysis of solder joint reliability. The model is based on the Anand model and Runge-Kutta time integ...

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Bibliographic Details
Main Author:	Koh, Yee Kan
Format:	Thesis
Language:	English
Published:	2004
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/5108/ http://eprints.utm.my/5108/1/KohYeeKanMFKM2004.pdf

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