Numerical modeling of cyclic stress-strain behavior
Of sn-pb solder joint during thermal fatigue

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Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue

This study examines the cyclic stress-strain response of solder joints in a surface mounted electronic assembly due to temperature cycles. For this purpose, a threedimensional model of an electronic test package is analyzed using finite element method. The model consists of 92 solder joints arran...

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Bibliographic Details
Main Authors:	Tamin, M N, Liew, Y B
Format:	Article
Language:	English
Published:	Universiti Kebangsaan Malaysia 2005
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/470/ http://eprints.utm.my/470/1/cem05-039_MNTamin__Ed_3.pdf

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