Tamin, M. N., & Liew, Y. B. (2005). Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue. Universiti Kebangsaan Malaysia.
Chicago Style (17th ed.) CitationTamin, M N., and Y B. Liew. Numerical Modeling of Cyclic Stress-strain Behavior Of Sn-pb Solder Joint During Thermal Fatigue. Universiti Kebangsaan Malaysia, 2005.
MLA (9th ed.) CitationTamin, M N., and Y B. Liew. Numerical Modeling of Cyclic Stress-strain Behavior Of Sn-pb Solder Joint During Thermal Fatigue. Universiti Kebangsaan Malaysia, 2005.
Warning: These citations may not always be 100% accurate.