Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish

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Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish

In flip chip interconnection an under bump metallurgy (UBM) is required to provide a diffusion barrier, an adhesion and a solderable surface. Among the various UBM systems available the electroless nickel / immersion gold (ENIG) has received greater attention in recent years due to its low cost and...

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Bibliographic Details
Main Author:	Tai, Siew Fong
Format:	Thesis
Language:	English
Published:	2003
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/4392/ http://eprints.utm.my/4392/1/TaiSiewFongMFKM2003.pdf

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