Mechanism-based reliability model for electronic packages

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Mechanism-based reliability model for electronic packages

Mechanism-based reliability model is different from the conventional reliability model. It is generated based on a specific failure. The failure mechanism is studied in detail to obtain a model that incorporates all significant stressing variables. For fatigue driven failure, Coffin-Manson equation...

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Bibliographic Details
Main Author:	Ng, Chee Weng
Format:	Thesis
Language:	English
Published:	2005
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/4369/ http://eprints.utm.my/4369/1/NgCheeWengMFKM2005.pdf

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