Application of signal analysis techniques for condition monitoring of a wire bonding machine

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Application of signal analysis techniques for condition monitoring of a wire bonding machine

This paper investigates the technique to monitor the condition of a wire bonding machine that used in the integrated manufacturing (IC) industry. The machine forms the connection between the bonding pad on the die to the contacts of the leadframe. To ensure consistency in the process, defects in the...

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Bibliographic Details
Main Authors:	Ahmad, Puteri Aidawati, Sha'ameri, Ahmad Zuri, Sheikh Salleh, Sheikh Hussein, Mohd Badar, Omar, Mohd Hani, Mohammed Khalil
Format:	Article
Language:	English
Published:	ieee 2000
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utm.my/2326/ http://eprints.utm.my/2326/1/Ahmad2000__ApplicationOfSignalAnalysisTechniques.pdf

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