A vision problem in wire bonding
A requirement for good wire bonding is the existence of intermetallics between the gold ball and bond pad. A digital image of the surface of the gold ball that was attached to the bond pad was obtained and analysed with MATLAB. The `counting method' (CM) is proposed for determining the percenta...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
2000
|
| Subjects: | |
| Online Access: | http://eprints.utm.my/2032/ http://eprints.utm.my/2032/1/Noor2000__VisionProblemInWireBonding.pdf |
| _version_ | 1848890270002708480 |
|---|---|
| author | Mohd. Noor, Norliza Mohd. Rijal, Omar Mohd. Badar, Omar P'ng, Yik Thon |
| author_facet | Mohd. Noor, Norliza Mohd. Rijal, Omar Mohd. Badar, Omar P'ng, Yik Thon |
| author_sort | Mohd. Noor, Norliza |
| building | UTeM Institutional Repository |
| collection | Online Access |
| description | A requirement for good wire bonding is the existence of intermetallics between the gold ball and bond pad. A digital image of the surface of the gold ball that was attached to the bond pad was obtained and analysed with MATLAB. The `counting method' (CM) is proposed for determining the percentage of intermetallics formation. Four experiments were performed to investigate the reliability of CM, the effect of light-offset, and the performance of a quality assistant (QA) in his ability to visually estimate (the visual method) the intermetallics coverage. The main results indicate that the visual method is inconsistent and less accurate than the counting method. The QA performs well for high intermetallics coverage, whilst for an approximately 50% intermetallics coverage the QA tends to overestimate. Critical remarks related to modeling the digital image are presented |
| first_indexed | 2025-11-15T20:39:24Z |
| format | Article |
| id | utm-2032 |
| institution | Universiti Teknologi Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T20:39:24Z |
| publishDate | 2000 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | utm-20322017-10-19T05:02:27Z http://eprints.utm.my/2032/ A vision problem in wire bonding Mohd. Noor, Norliza Mohd. Rijal, Omar Mohd. Badar, Omar P'ng, Yik Thon TK Electrical engineering. Electronics Nuclear engineering A requirement for good wire bonding is the existence of intermetallics between the gold ball and bond pad. A digital image of the surface of the gold ball that was attached to the bond pad was obtained and analysed with MATLAB. The `counting method' (CM) is proposed for determining the percentage of intermetallics formation. Four experiments were performed to investigate the reliability of CM, the effect of light-offset, and the performance of a quality assistant (QA) in his ability to visually estimate (the visual method) the intermetallics coverage. The main results indicate that the visual method is inconsistent and less accurate than the counting method. The QA performs well for high intermetallics coverage, whilst for an approximately 50% intermetallics coverage the QA tends to overestimate. Critical remarks related to modeling the digital image are presented 2000-11-24 Article PeerReviewed application/pdf en http://eprints.utm.my/2032/1/Noor2000__VisionProblemInWireBonding.pdf Mohd. Noor, Norliza and Mohd. Rijal, Omar and Mohd. Badar, Omar and P'ng, Yik Thon (2000) A vision problem in wire bonding. TENCON 2000. Proceedings , 1 . 299 -304. http://dx.doi.org/10.1109/TENCON.2000.893678 DOI:10.1109/TENCON.2000.893678 |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Mohd. Noor, Norliza Mohd. Rijal, Omar Mohd. Badar, Omar P'ng, Yik Thon A vision problem in wire bonding |
| title | A vision problem in wire bonding
|
| title_full | A vision problem in wire bonding
|
| title_fullStr | A vision problem in wire bonding
|
| title_full_unstemmed | A vision problem in wire bonding
|
| title_short | A vision problem in wire bonding
|
| title_sort | vision problem in wire bonding |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://eprints.utm.my/2032/ http://eprints.utm.my/2032/ http://eprints.utm.my/2032/ http://eprints.utm.my/2032/1/Noor2000__VisionProblemInWireBonding.pdf |