Optimization Of Solder Paste Printing Parameters Using Design Of Experiments (DOE)

Optimization Of Solder Paste Printing Parameters Using Design Of Experiments (DOE)

The Solder Paste Printing Process Is An Important Process In The Assembly Of Surface Mount Technology (SMT) Devices Using The Reflow Soldering Technique. There Is A Wide Agreement In The Industry That The Paste Printing Process Accounts For The Majority Of Assembly Defects. Experience With This Proc...

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Bibliographic Details
Main Authors: Sekharan, Gopal, Mohd. Rohani, Jafri, Mohd. Yusof, Sha'ri, Abu Bakar, Zailis
Format: Article
Language:English
Published: Penerbit UTM Press 2005
Subjects:
Q Science (General)
T Technology (General)
Online Access:http://eprints.utm.my/1719/
http://eprints.utm.my/1719/1/JTDIS43A2.pdf

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