Layout optimization and manning ratio improvement

The objective of this study is to design a new layout for space optimization and improve manning ratio . An ergonomic new peripheral for IC bonding machine s is also designed to obtain space savings. The study is limited to the IC bonding process of one product on a single production floor of the fa...

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Main Author: Yeong, Weng Harn
Format: Thesis
Language:English
Published: 2010
Subjects:
Online Access:http://eprints.utm.my/11237/
http://eprints.utm.my/11237/1/YeongWengHarnMFKM2010.pdf
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author Yeong, Weng Harn
author_facet Yeong, Weng Harn
author_sort Yeong, Weng Harn
building UTeM Institutional Repository
collection Online Access
description The objective of this study is to design a new layout for space optimization and improve manning ratio . An ergonomic new peripheral for IC bonding machine s is also designed to obtain space savings. The study is limited to the IC bonding process of one product on a single production floor of the factory with sampling done on one module containing two rows of machines. The study is divided into 3 major components which is layout optimization, manning ratio improvement and new peripheral design. Layout and peripheral design is mostly don e using AUTOCAD and work sampling methods is used widely in data collection of manning ratio. Data validation is done by surveying production floor workers on their feedback during the ‘trial -run’ of the new layout, manning ratio and peripheral design. A semiconductor manufacturer is selected for this case study. Upon completion of this study, additional machines can be fitted into existing space, manning ratio is improved requiring less manpower for more machines and a new peripheral which is space saving and ergonomic is designed. As a result, there is significant cost savings and improved productivity. Finally, the machine capacity gap to meet customer demand is closed.
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institution Universiti Teknologi Malaysia
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spelling utm-112372018-05-30T02:35:03Z http://eprints.utm.my/11237/ Layout optimization and manning ratio improvement Yeong, Weng Harn HD Industries. Land use. Labor TJ Mechanical engineering and machinery The objective of this study is to design a new layout for space optimization and improve manning ratio . An ergonomic new peripheral for IC bonding machine s is also designed to obtain space savings. The study is limited to the IC bonding process of one product on a single production floor of the factory with sampling done on one module containing two rows of machines. The study is divided into 3 major components which is layout optimization, manning ratio improvement and new peripheral design. Layout and peripheral design is mostly don e using AUTOCAD and work sampling methods is used widely in data collection of manning ratio. Data validation is done by surveying production floor workers on their feedback during the ‘trial -run’ of the new layout, manning ratio and peripheral design. A semiconductor manufacturer is selected for this case study. Upon completion of this study, additional machines can be fitted into existing space, manning ratio is improved requiring less manpower for more machines and a new peripheral which is space saving and ergonomic is designed. As a result, there is significant cost savings and improved productivity. Finally, the machine capacity gap to meet customer demand is closed. 2010-05 Thesis NonPeerReviewed application/pdf en http://eprints.utm.my/11237/1/YeongWengHarnMFKM2010.pdf Yeong, Weng Harn (2010) Layout optimization and manning ratio improvement. Masters thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering.
spellingShingle HD Industries. Land use. Labor
TJ Mechanical engineering and machinery
Yeong, Weng Harn
Layout optimization and manning ratio improvement
title Layout optimization and manning ratio improvement
title_full Layout optimization and manning ratio improvement
title_fullStr Layout optimization and manning ratio improvement
title_full_unstemmed Layout optimization and manning ratio improvement
title_short Layout optimization and manning ratio improvement
title_sort layout optimization and manning ratio improvement
topic HD Industries. Land use. Labor
TJ Mechanical engineering and machinery
url http://eprints.utm.my/11237/
http://eprints.utm.my/11237/1/YeongWengHarnMFKM2010.pdf