Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes

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Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes

In the on-going trend towards miniaturization in the electronics packaging industry, the increasing popularity of ultra fine line technologies has brought into question the physical aspects of pad topography and metallization. As the solder joints shrink in size, the thickness of the pad metallizati...

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Bibliographic Details
Main Author:	Idris, Siti Rabiatull Aisha
Format:	Thesis
Language:	English
Published:	2008
Subjects:	TJ Mechanical engineering and machinery TS Manufactures
Online Access:	http://eprints.utm.my/10069/ http://eprints.utm.my/10069/1/SitiRabiatullAishaMFKM2008.pdf

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