Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes

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Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes

Due to increasing environmental and health concerns related to the toxicity of traditional tin-lead solders, lead-free solders appear as promising replacement for the eutectic solder alloy in flip chip technology. Then a surface finish is designed to protect the copper surface against oxidation as w...

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Bibliographic Details
Main Author:	Abu Hassan, Nurfazlin
Format:	Thesis
Language:	English
Published:	2009
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/10063/ http://eprints.utm.my/10063/1/NurfazlinAbuHassanMFKM2009.pdf

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