Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish

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Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish

The different surface finish and solder size on printed circuit board strongly affect the formation of intermetallic compounds (IMCs) and solder joint reliability. Among of various surface finish in the electronic industry, electroless nickel/immersion gold is the most popular at the moment. Howe...

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Bibliographic Details
Main Author:	Mohamed Anuar, Rabiatul Adawiyah
Format:	Thesis
Language:	English English English
Published:	2017
Subjects:	TK7800-8360 Electronics
Online Access:	http://eprints.uthm.edu.my/853/ http://eprints.uthm.edu.my/853/1/24p%20RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR.pdf http://eprints.uthm.edu.my/853/2/RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/853/3/RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR%20WATERMARK.pdf

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