Variability reduction in stencil printing of solder paste for surface mount technology

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Variability reduction in stencil printing of solder paste for surface mount technology

Competition in stencil printing to produce excellence in the finished product is intense. Faults in the printing process are a major source of board failure. Studies have shown that over 63% of defects identified after reDow originated from the solder paste printing ( A. Lotfi ,1998 ) . Howeve...

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Bibliographic Details
Main Author:	Ibrahim, Mustaffa
Format:	Thesis
Language:	English
Published:	1998
Subjects:	TK Electrical engineering. Electronics Nuclear engineering TK7800-8360 Electronics
Online Access:	http://eprints.uthm.edu.my/7697/ http://eprints.uthm.edu.my/7697/1/24p%20MUSTAFFA%20IBRAHIM.pdf

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