Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCN...
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| Format: | Article |
| Language: | English |
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Springer Link
2022
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| Online Access: | http://eprints.uthm.edu.my/7099/ http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf |
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| author | Dele-Afolabi, T. T. M. A., Azmah Hanim K., Vidyatharran K. A., Matori O., Saliza Azlina R., Calin |
| author_facet | Dele-Afolabi, T. T. M. A., Azmah Hanim K., Vidyatharran K. A., Matori O., Saliza Azlina R., Calin |
| author_sort | Dele-Afolabi, T. T. |
| building | UTHM Institutional Repository |
| collection | Online Access |
| description | The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg
(Electroless Nickel Immersion Silver) surface finish on the formation of interfacial
microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was
investigated in this study. Plain and composite solders (SAC-xCNT; x = 0, 0.01, 0.05
and 0.1wt%) were successfully synthesized through the powdermetallurgy route and
afterwards soldered on the ENIAg surface finish and plain Cu substrates. Detailed
analysis of the microstructure revealed the formation of the Cu6Sn5 IMC at the SAC
solder/Cu substrate interface of the SAC-xCNT/Cu solder interconnects. Whereas,
the Ni3Sn4 IMC and (Cu,Ni)6Sn5 IMC appeared at the SAC solder/ENIAg substrate
interface of the SAC-xCNT/ENIAg. The MWCNTs-reinforced SAC composite solder
interconnects exhibited thinner interfacial IMC layer thicknesses relative to the plain
counterparts for both substrates used. Given the prospects of the ENIAg as a reliable
surface finishmaterial, the SAC-xCNT/ENIAg exhibited IMC thickness valueswithin
the range of 2.98–2.65 lm as compared to the 5.23–3.61 lm demonstrated by the SAC�xCNT/Cu. Overall, the strengthening capacity of the MWCNTs was well-defined in
both sample grades, with the SAC-0.05CNT/Cu and SAC-0.05CNT/ENIAg exhibit�ing the highest shear strength values of 10.23 MPa and 11.14 MPa, respectively. |
| first_indexed | 2025-11-15T20:19:14Z |
| format | Article |
| id | uthm-7099 |
| institution | Universiti Tun Hussein Onn Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T20:19:14Z |
| publishDate | 2022 |
| publisher | Springer Link |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | uthm-70992022-05-31T07:20:54Z http://eprints.uthm.edu.my/7099/ Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish Dele-Afolabi, T. T. M. A., Azmah Hanim K., Vidyatharran K. A., Matori O., Saliza Azlina R., Calin T Technology (General) The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT; x = 0, 0.01, 0.05 and 0.1wt%) were successfully synthesized through the powdermetallurgy route and afterwards soldered on the ENIAg surface finish and plain Cu substrates. Detailed analysis of the microstructure revealed the formation of the Cu6Sn5 IMC at the SAC solder/Cu substrate interface of the SAC-xCNT/Cu solder interconnects. Whereas, the Ni3Sn4 IMC and (Cu,Ni)6Sn5 IMC appeared at the SAC solder/ENIAg substrate interface of the SAC-xCNT/ENIAg. The MWCNTs-reinforced SAC composite solder interconnects exhibited thinner interfacial IMC layer thicknesses relative to the plain counterparts for both substrates used. Given the prospects of the ENIAg as a reliable surface finishmaterial, the SAC-xCNT/ENIAg exhibited IMC thickness valueswithin the range of 2.98–2.65 lm as compared to the 5.23–3.61 lm demonstrated by the SAC�xCNT/Cu. Overall, the strengthening capacity of the MWCNTs was well-defined in both sample grades, with the SAC-0.05CNT/Cu and SAC-0.05CNT/ENIAg exhibit�ing the highest shear strength values of 10.23 MPa and 11.14 MPa, respectively. Springer Link 2022 Article PeerReviewed text en http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf Dele-Afolabi, T. T. and M. A., Azmah Hanim and K., Vidyatharran and K. A., Matori and O., Saliza Azlina and R., Calin (2022) Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Journal of Materials Science: Materials in Electronics volume, 33. ISSN 8233–8246 https://doi.org/10.1007/s10854-022-07974-8 |
| spellingShingle | T Technology (General) Dele-Afolabi, T. T. M. A., Azmah Hanim K., Vidyatharran K. A., Matori O., Saliza Azlina R., Calin Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish |
| title | Interfacial microstructure evolution and shear strength
of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105)
composite solder interconnects on plain Cu and ENIAg
surface finish |
| title_full | Interfacial microstructure evolution and shear strength
of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105)
composite solder interconnects on plain Cu and ENIAg
surface finish |
| title_fullStr | Interfacial microstructure evolution and shear strength
of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105)
composite solder interconnects on plain Cu and ENIAg
surface finish |
| title_full_unstemmed | Interfacial microstructure evolution and shear strength
of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105)
composite solder interconnects on plain Cu and ENIAg
surface finish |
| title_short | Interfacial microstructure evolution and shear strength
of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105)
composite solder interconnects on plain Cu and ENIAg
surface finish |
| title_sort | interfacial microstructure evolution and shear strength
of mwcnts-reinforced sn-1.0ag-0.5cu (sac105)
composite solder interconnects on plain cu and eniag
surface finish |
| topic | T Technology (General) |
| url | http://eprints.uthm.edu.my/7099/ http://eprints.uthm.edu.my/7099/ http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf |