APA (7th ed.) Citation

Dele-Afolabi, T. T., M. A., A. H., K., V., K. A., M., O., S. A., & R., C. (2022). Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Springer Link.

Chicago Style (17th ed.) Citation

Dele-Afolabi, T. T., Azmah Hanim M. A., Vidyatharran K., Matori K. A., Saliza Azlina O., and Calin R. Interfacial Microstructure Evolution and Shear Strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite Solder Interconnects on Plain Cu and ENIAg surface Finish. Springer Link, 2022.

MLA (9th ed.) Citation

Dele-Afolabi, T. T., et al. Interfacial Microstructure Evolution and Shear Strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite Solder Interconnects on Plain Cu and ENIAg surface Finish. Springer Link, 2022.