Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish

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Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish

The growth of an intermetallic compound (IMC) can influence the behavior of solder joints. In this study, the different percentages of Ag in Sn-xAg (value x = 2.5 and 3.5 wt.%) solder alloy were involved along with ENImAg surface finish to reveal the solder joints reliability in term of IMC thicknes...

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Bibliographic Details
Main Authors:	Mohamed Anuar, Rabiatul Adawiyah, Hamidin, Mohamad Shahrom, Osman, Saliza Azlina, Othman, Mohamad Hilmi
Format:	Article
Language:	English
Published:	WARSE 2020
Subjects:	TP155-156 Chemical engineering
Online Access:	http://eprints.uthm.edu.my/6341/ http://eprints.uthm.edu.my/6341/1/AJ%202020%20%28818%29.pdf

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