M. A., A. H., N., M. K., Wei, C. K., T. T., D., & O., S. A. (2020). Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish. Springer.
Chicago Style (17th ed.) CitationM. A., Azmah Hanim, Muhamad Kamil N., Chuan Khang Wei, Dele‑Afolabi T. T., and Saliza Azlina O. Microstructural and Shear Strength Properties of RHA-reinforced Sn–0.7Cu Composite Solder Joints on Bare Cu and ENIAg Surface Finish. Springer, 2020.
MLA (9th ed.) CitationM. A., Azmah Hanim, et al. Microstructural and Shear Strength Properties of RHA-reinforced Sn–0.7Cu Composite Solder Joints on Bare Cu and ENIAg Surface Finish. Springer, 2020.
Warning: These citations may not always be 100% accurate.