The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg

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The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg

The effect of intermetallic compound layer between Sn-4.0 Ag-0.5Cu solder bump and electroless nickel/immersion silver (ENImAg) surface finish under different cooling rate during multiple reflow condition was investigated. The results show that the interfacial (Cu, Ni)6Sn5 intermetallic compound wer...

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Bibliographic Details
Main Authors:	M.A., Rabiatul Adawiyah, A.B., M. Hafiz, O., Saliza Azlina, J., Zolhafizi, W.M., Wan Nur Azrina, O., Shahrul Azmir
Format:	Article
Published:	Wiley-VCH Verlag 2019
Subjects:	TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:	http://eprints.uthm.edu.my/4240/

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