APA (7th ed.) Citation

M.A., R. A., A.B., M. H., O., S. A., J., Z., W.M., W. N. A., & O., S. A. (2019). The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg. Wiley-VCH Verlag.

Chicago Style (17th ed.) Citation

M.A., Rabiatul Adawiyah, M. Hafiz A.B., Saliza Azlina O., Zolhafizi J., Wan Nur Azrina W.M., and Shahrul Azmir O. The Effect of Cooling Rate During Multiple Reflow Soldering on Intermetallic Layer of Sn-4.0 Ag-0.5Cu/ENImAg. Wiley-VCH Verlag, 2019.

MLA (9th ed.) Citation

M.A., Rabiatul Adawiyah, et al. The Effect of Cooling Rate During Multiple Reflow Soldering on Intermetallic Layer of Sn-4.0 Ag-0.5Cu/ENImAg. Wiley-VCH Verlag, 2019.