The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish

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The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish

Surface finish is coated layer plated on a bare copper board of printed circuit board (PCB). Among PCB surface finishes, Electroless Nickel/Immersion Gold (ENIG) finish is a top choice among electronic packaging manufacturer due to its excellent properties for PCB. However, the use of gold ele...

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Bibliographic Details
Main Author:	Jaidi, Zolhafizi
Format:	Thesis
Language:	English English English
Published:	2020
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.uthm.edu.my/1161/ http://eprints.uthm.edu.my/1161/1/24p%20ZOLHAFIZI%20JAIDI.pdf http://eprints.uthm.edu.my/1161/2/ZOLHAFIZI%20JAIDI%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/1161/3/ZOLHAFIZI%20JAIDI%20WATERMARK.pdf

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