APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE
NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY

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APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY

Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield. The team focused on Non Stick on Pa...

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Bibliographic Details
Main Author:	Sivakumar, Dhar Malingam
Format:	Conference or Workshop Item
Language:	English
Published:	2004
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utem.edu.my/id/eprint/4312/ http://eprints.utem.edu.my/id/eprint/4312/1/TPM-ICAMT_2004.pdf

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