APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield. The team focused on Non Stick on Pa...
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| Format: | Conference or Workshop Item |
| Language: | English |
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2004
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| Online Access: | http://eprints.utem.edu.my/id/eprint/4312/ http://eprints.utem.edu.my/id/eprint/4312/1/TPM-ICAMT_2004.pdf |
| _version_ | 1848887015928496128 |
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| author | Sivakumar, Dhar Malingam |
| author_facet | Sivakumar, Dhar Malingam |
| author_sort | Sivakumar, Dhar Malingam |
| building | UTeM Institutional Repository |
| collection | Online Access |
| description | Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield.
The team focused on Non Stick on Pad (NSOP), which was the top yield lost contributor. Floating die contributed 48% of the NSOP defect. How Focus Improvement activity is used to reduce Non Stick on Pad due to floating die is shown.
As a result NSOP due to floating die had been reduced from 1300 parts per million (ppm) to 650 ppm a reduction of 50% within one year.
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| first_indexed | 2025-11-15T19:47:40Z |
| format | Conference or Workshop Item |
| id | utem-4312 |
| institution | Universiti Teknikal Malaysia Melaka |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T19:47:40Z |
| publishDate | 2004 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | utem-43122015-05-28T02:41:04Z http://eprints.utem.edu.my/id/eprint/4312/ APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY Sivakumar, Dhar Malingam TJ Mechanical engineering and machinery Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield. The team focused on Non Stick on Pad (NSOP), which was the top yield lost contributor. Floating die contributed 48% of the NSOP defect. How Focus Improvement activity is used to reduce Non Stick on Pad due to floating die is shown. As a result NSOP due to floating die had been reduced from 1300 parts per million (ppm) to 650 ppm a reduction of 50% within one year. 2004 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.utem.edu.my/id/eprint/4312/1/TPM-ICAMT_2004.pdf Sivakumar, Dhar Malingam (2004) APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY. In: 3rd INTERNATIONAL CONFERENCE ON ADVANCED MANUFACTURING TECHNOLOGY (ICAMT 2004), 11-13 May 2004, Kuala Lumpur, Malaysia. |
| spellingShingle | TJ Mechanical engineering and machinery Sivakumar, Dhar Malingam APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY |
| title | APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE
NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
|
| title_full | APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE
NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
|
| title_fullStr | APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE
NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
|
| title_full_unstemmed | APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE
NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
|
| title_short | APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE
NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY
|
| title_sort | application of total productive maintenance to reduce
non-stick on pad problem in a semiconductor industry |
| topic | TJ Mechanical engineering and machinery |
| url | http://eprints.utem.edu.my/id/eprint/4312/ http://eprints.utem.edu.my/id/eprint/4312/1/TPM-ICAMT_2004.pdf |