Detecting head in pillow defect (HIP) by using deep learning and image processing technique

Deep learning is an Artificial Intelligence (AI) method that mimics the ways human brain processing data and recognizes the data or objects. It is a subset of machine learning which utilizes the hierarchical level of artificial neural networks (ANN) to perform the process of machine learning (Hargra...

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Main Author: Tan, Wei Jin
Format: Final Year Project / Dissertation / Thesis
Published: 2021
Subjects:
Online Access:http://eprints.utar.edu.my/4272/
http://eprints.utar.edu.my/4272/2/17ACB02302_FYP.pdf
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author Tan, Wei Jin
author_facet Tan, Wei Jin
author_sort Tan, Wei Jin
building UTAR Institutional Repository
collection Online Access
description Deep learning is an Artificial Intelligence (AI) method that mimics the ways human brain processing data and recognizes the data or objects. It is a subset of machine learning which utilizes the hierarchical level of artificial neural networks (ANN) to perform the process of machine learning (Hargrave, 2019). Deep learning has very great potential of wide adoption in various industries. In fact, deep learning has already been used by corporations and start-ups such as Google, Facebook, Amazon, Tesla etc for several different tasks such as filtering fake news, analysing shopping trends and developing self-driving cars. In the manufacturing sectors, deep learning techniques were usually used to aid the engineers or inspectors in making decisions in the production line or the quality inspection phase. However, there are still various reasons why deep learning was not largely implemented in the manufacturing sector especially in the detection of Head in Pillow (HIP) defects that occurred in the Ball Grid Array (BGA) of a printed circuit board (PCB). This project aims to design a robust deep learning model that could be implemented to speed up and ease the process of detecting the HIP defects. The 3 Dimensional (3D) Convolutional Neural Network (CNN) will be the foundation of the deep learning model which will deal with the grayscale BGA slice images that were stacked together. The outcome of the project will be a robust deep learning model that could classify the HIP defects on BGA joints in greyscale which have not more than 9 slices. Over 200 of 3D CNN models with different hyperparameters and architecture are created in this project to achieve the objectives of the project.
first_indexed 2025-11-15T19:33:21Z
format Final Year Project / Dissertation / Thesis
id utar-4272
institution Universiti Tunku Abdul Rahman
institution_category Local University
last_indexed 2025-11-15T19:33:21Z
publishDate 2021
recordtype eprints
repository_type Digital Repository
spelling utar-42722022-03-09T12:54:57Z Detecting head in pillow defect (HIP) by using deep learning and image processing technique Tan, Wei Jin QA75 Electronic computers. Computer science T Technology (General) Deep learning is an Artificial Intelligence (AI) method that mimics the ways human brain processing data and recognizes the data or objects. It is a subset of machine learning which utilizes the hierarchical level of artificial neural networks (ANN) to perform the process of machine learning (Hargrave, 2019). Deep learning has very great potential of wide adoption in various industries. In fact, deep learning has already been used by corporations and start-ups such as Google, Facebook, Amazon, Tesla etc for several different tasks such as filtering fake news, analysing shopping trends and developing self-driving cars. In the manufacturing sectors, deep learning techniques were usually used to aid the engineers or inspectors in making decisions in the production line or the quality inspection phase. However, there are still various reasons why deep learning was not largely implemented in the manufacturing sector especially in the detection of Head in Pillow (HIP) defects that occurred in the Ball Grid Array (BGA) of a printed circuit board (PCB). This project aims to design a robust deep learning model that could be implemented to speed up and ease the process of detecting the HIP defects. The 3 Dimensional (3D) Convolutional Neural Network (CNN) will be the foundation of the deep learning model which will deal with the grayscale BGA slice images that were stacked together. The outcome of the project will be a robust deep learning model that could classify the HIP defects on BGA joints in greyscale which have not more than 9 slices. Over 200 of 3D CNN models with different hyperparameters and architecture are created in this project to achieve the objectives of the project. 2021-04-16 Final Year Project / Dissertation / Thesis NonPeerReviewed application/pdf http://eprints.utar.edu.my/4272/2/17ACB02302_FYP.pdf Tan, Wei Jin (2021) Detecting head in pillow defect (HIP) by using deep learning and image processing technique. Final Year Project, UTAR. http://eprints.utar.edu.my/4272/
spellingShingle QA75 Electronic computers. Computer science
T Technology (General)
Tan, Wei Jin
Detecting head in pillow defect (HIP) by using deep learning and image processing technique
title Detecting head in pillow defect (HIP) by using deep learning and image processing technique
title_full Detecting head in pillow defect (HIP) by using deep learning and image processing technique
title_fullStr Detecting head in pillow defect (HIP) by using deep learning and image processing technique
title_full_unstemmed Detecting head in pillow defect (HIP) by using deep learning and image processing technique
title_short Detecting head in pillow defect (HIP) by using deep learning and image processing technique
title_sort detecting head in pillow defect (hip) by using deep learning and image processing technique
topic QA75 Electronic computers. Computer science
T Technology (General)
url http://eprints.utar.edu.my/4272/
http://eprints.utar.edu.my/4272/2/17ACB02302_FYP.pdf