Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application

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Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application

The scale-down trend increases the chips’ density and the high power handling capability generates unnecessary heat which can disrupt the reliability of the electronic devices. Therefore, various types of cooling solution have been proposed to enhance heat dissipation from electronic devices. One of...

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Bibliographic Details
Main Author:	Nor Haziq, Naqiuddin Hamli
Format:	Final Year Project / Dissertation / Thesis
Published:	2019
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utar.edu.my/3626/ http://eprints.utar.edu.my/3626/1/ESA%2D2019%2D1607629%2D1.pdf

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