Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application
The scale-down trend increases the chips’ density and the high power handling capability generates unnecessary heat which can disrupt the reliability of the electronic devices. Therefore, various types of cooling solution have been proposed to enhance heat dissipation from electronic devices. One of...
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| Format: | Final Year Project / Dissertation / Thesis |
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2019
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| Online Access: | http://eprints.utar.edu.my/3626/ http://eprints.utar.edu.my/3626/1/ESA%2D2019%2D1607629%2D1.pdf |
| _version_ | 1848885949803528192 |
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| author | Nor Haziq, Naqiuddin Hamli |
| author_facet | Nor Haziq, Naqiuddin Hamli |
| author_sort | Nor Haziq, Naqiuddin Hamli |
| building | UTAR Institutional Repository |
| collection | Online Access |
| description | The scale-down trend increases the chips’ density and the high power handling capability generates unnecessary heat which can disrupt the reliability of the electronic devices. Therefore, various types of cooling solution have been proposed to enhance heat dissipation from electronic devices. One of the solutions is using an inexpensive straight-channel heat sink. However, the presence of a large temperature gradient between the upstream and downstream in the straight-channel can shorten the life span of the device and subsequently reduce the reliability. In this work, a novel segmented micro-channel is introduced to improve the thermal performance of the straight-channel heat sink. Computational fluid dynamic analysis is performed to investigate the performance of the micro-channel heat sink. Next, Taguchi-grey method is applied to optimize the design of the segmented micro-channel. The results indicate that three segments of the segmented micro-channel, fin width-1 mm, fin length-2 mm, fin transverse distance-5 mm and channel width-1 mm is an optimized design of the segmented micro-channel with enhanced heat transfer performance and minimum pressure drop. It is also found that the optimized micro-channel heat sink is able to cool the chip with a heat flux of 800 W to 56.6 oC and pumping power of 0.13 W using 15 gs-1 of water. Experimental work shows that the result deviates less than 5% for average temperature and temperature variation at 15 gs-1. |
| first_indexed | 2025-11-15T19:30:44Z |
| format | Final Year Project / Dissertation / Thesis |
| id | utar-3626 |
| institution | Universiti Tunku Abdul Rahman |
| institution_category | Local University |
| last_indexed | 2025-11-15T19:30:44Z |
| publishDate | 2019 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | utar-36262019-12-17T04:18:00Z Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application Nor Haziq, Naqiuddin Hamli TJ Mechanical engineering and machinery The scale-down trend increases the chips’ density and the high power handling capability generates unnecessary heat which can disrupt the reliability of the electronic devices. Therefore, various types of cooling solution have been proposed to enhance heat dissipation from electronic devices. One of the solutions is using an inexpensive straight-channel heat sink. However, the presence of a large temperature gradient between the upstream and downstream in the straight-channel can shorten the life span of the device and subsequently reduce the reliability. In this work, a novel segmented micro-channel is introduced to improve the thermal performance of the straight-channel heat sink. Computational fluid dynamic analysis is performed to investigate the performance of the micro-channel heat sink. Next, Taguchi-grey method is applied to optimize the design of the segmented micro-channel. The results indicate that three segments of the segmented micro-channel, fin width-1 mm, fin length-2 mm, fin transverse distance-5 mm and channel width-1 mm is an optimized design of the segmented micro-channel with enhanced heat transfer performance and minimum pressure drop. It is also found that the optimized micro-channel heat sink is able to cool the chip with a heat flux of 800 W to 56.6 oC and pumping power of 0.13 W using 15 gs-1 of water. Experimental work shows that the result deviates less than 5% for average temperature and temperature variation at 15 gs-1. 2019 Final Year Project / Dissertation / Thesis NonPeerReviewed application/pdf http://eprints.utar.edu.my/3626/1/ESA%2D2019%2D1607629%2D1.pdf Nor Haziq, Naqiuddin Hamli (2019) Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application. Master dissertation/thesis, UTAR. http://eprints.utar.edu.my/3626/ |
| spellingShingle | TJ Mechanical engineering and machinery Nor Haziq, Naqiuddin Hamli Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application |
| title | Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application |
| title_full | Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application |
| title_fullStr | Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application |
| title_full_unstemmed | Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application |
| title_short | Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application |
| title_sort | design and development of novel fin micro channel heat sink for high heat flux application |
| topic | TJ Mechanical engineering and machinery |
| url | http://eprints.utar.edu.my/3626/ http://eprints.utar.edu.my/3626/1/ESA%2D2019%2D1607629%2D1.pdf |