Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process

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Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process

Bibliographic Details
Main Author:	Nur Afiqqa Rashid
Format:	Final Year Project / Dissertation / Thesis
Published:	2019
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utar.edu.my/3331/ http://eprints.utar.edu.my/3331/1/FYP_Report_Afiqqa_final__correction.pdf

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