Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process
| Main Author: | |
|---|---|
| Format: | Final Year Project / Dissertation / Thesis |
| Published: |
2019
|
| Subjects: | |
| Online Access: | http://eprints.utar.edu.my/3331/ http://eprints.utar.edu.my/3331/1/FYP_Report_Afiqqa_final__correction.pdf |
| _version_ | 1848885875178471424 |
|---|---|
| author | Nur Afiqqa Rashid, |
| author_facet | Nur Afiqqa Rashid, |
| author_sort | Nur Afiqqa Rashid, |
| building | UTAR Institutional Repository |
| collection | Online Access |
| first_indexed | 2025-11-15T19:29:33Z |
| format | Final Year Project / Dissertation / Thesis |
| id | utar-3331 |
| institution | Universiti Tunku Abdul Rahman |
| institution_category | Local University |
| last_indexed | 2025-11-15T19:29:33Z |
| publishDate | 2019 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | utar-33312019-07-03T09:41:00Z Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process Nur Afiqqa Rashid, TK Electrical engineering. Electronics Nuclear engineering 2019-04 Final Year Project / Dissertation / Thesis NonPeerReviewed application/pdf http://eprints.utar.edu.my/3331/1/FYP_Report_Afiqqa_final__correction.pdf Nur Afiqqa Rashid, (2019) Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process. Master dissertation/thesis, UTAR. http://eprints.utar.edu.my/3331/ |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Nur Afiqqa Rashid, Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process |
| title | Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process |
| title_full | Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process |
| title_fullStr | Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process |
| title_full_unstemmed | Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process |
| title_short | Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process |
| title_sort | improvement of powermite package crack and chip die process optimization study in die attach and molding process |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://eprints.utar.edu.my/3331/ http://eprints.utar.edu.my/3331/1/FYP_Report_Afiqqa_final__correction.pdf |