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Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process
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Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process

Bibliographic Details
Main Author: Nur Afiqqa Rashid
Format: Final Year Project / Dissertation / Thesis
Published: 2019
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utar.edu.my/3331/
http://eprints.utar.edu.my/3331/1/FYP_Report_Afiqqa_final__correction.pdf
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