Lam, W. M. (2011). Development of environmental friendly Electrical Conductive Adhesives (ECAS) as a replacement to lead based solder materials in electronic manufacturing industry.
Chicago Style (17th ed.) CitationLam, Wai Man. Development of Environmental Friendly Electrical Conductive Adhesives (ECAS) as a Replacement to Lead Based Solder Materials in Electronic Manufacturing Industry. 2011.
MLA (9th ed.) CitationLam, Wai Man. Development of Environmental Friendly Electrical Conductive Adhesives (ECAS) as a Replacement to Lead Based Solder Materials in Electronic Manufacturing Industry. 2011.
Warning: These citations may not always be 100% accurate.