Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications

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Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications

Bibliographic Details
Main Author:	Liew, Jian Ping
Format:	Final Year Project / Dissertation / Thesis
Published:	2016
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utar.edu.my/2189/ http://eprints.utar.edu.my/2189/1/ESA%2D2016%2D1106774%2D1.pdf

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