Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications
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| Format: | Final Year Project / Dissertation / Thesis |
| Published: |
2016
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| Online Access: | http://eprints.utar.edu.my/2189/ http://eprints.utar.edu.my/2189/1/ESA%2D2016%2D1106774%2D1.pdf |
| _version_ | 1848885603770302464 |
|---|---|
| author | Liew, Jian Ping |
| author_facet | Liew, Jian Ping |
| author_sort | Liew, Jian Ping |
| building | UTAR Institutional Repository |
| collection | Online Access |
| first_indexed | 2025-11-15T19:25:14Z |
| format | Final Year Project / Dissertation / Thesis |
| id | utar-2189 |
| institution | Universiti Tunku Abdul Rahman |
| institution_category | Local University |
| last_indexed | 2025-11-15T19:25:14Z |
| publishDate | 2016 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | utar-21892017-08-14T03:04:44Z Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications Liew, Jian Ping TJ Mechanical engineering and machinery 2016 Final Year Project / Dissertation / Thesis NonPeerReviewed application/pdf http://eprints.utar.edu.my/2189/1/ESA%2D2016%2D1106774%2D1.pdf Liew, Jian Ping (2016) Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications. Master dissertation/thesis, UTAR. http://eprints.utar.edu.my/2189/ |
| spellingShingle | TJ Mechanical engineering and machinery Liew, Jian Ping Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications |
| title | Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications |
| title_full | Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications |
| title_fullStr | Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications |
| title_full_unstemmed | Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications |
| title_short | Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications |
| title_sort | rheological studies of silver nanoparticles based isotropic conductive adhesive (ag-icas) for microelectronic packaging applications |
| topic | TJ Mechanical engineering and machinery |
| url | http://eprints.utar.edu.my/2189/ http://eprints.utar.edu.my/2189/1/ESA%2D2016%2D1106774%2D1.pdf |