APA (7th ed.) Citation

Liew, J. P. (2016). Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications.

Chicago Style (17th ed.) Citation

Liew, Jian Ping. Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications. 2016.

MLA (9th ed.) Citation

Liew, Jian Ping. Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications. 2016.

Warning: These citations may not always be 100% accurate.