Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].

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Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].

Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic asse...

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Bibliographic Details
Main Author:	Mayappan, Ramani
Format:	Thesis
Language:	English
Published:	2007
Subjects:	TK7800-8360 Electronics
Online Access:	http://eprints.usm.my/9486/ http://eprints.usm.my/9486/1/STUDY_ON_THE_WETTING_PROPERTIES%2C_INTERFACIAL_REACTIONS_AND_MECHANICAL_PROPERTIES_OF_Sn-Zn_AND_Sn-Zn-Bi_SOLDERS_ON_COPPER_METALLIZATION.pdf

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