Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards hi...
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2006
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/9052/ http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf |
| _version_ | 1848870654987730944 |
|---|---|
| author | Munusamy, Sri Jaiandran |
| author_facet | Munusamy, Sri Jaiandran |
| author_sort | Munusamy, Sri Jaiandran |
| building | USM Institutional Repository |
| collection | Online Access |
| description | Industri electronik berkembang ke arah qualiti dan kelajuan
computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip.
The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging.
|
| first_indexed | 2025-11-15T15:27:37Z |
| format | Thesis |
| id | usm-9052 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T15:27:37Z |
| publishDate | 2006 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-90522017-04-17T09:26:38Z http://eprints.usm.my/9052/ Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. Munusamy, Sri Jaiandran TJ255-265 Heat engines Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging. 2006-01 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. Masters thesis, Universiti Sains Malaysia. |
| spellingShingle | TJ255-265 Heat engines Munusamy, Sri Jaiandran Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title | Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_full | Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_fullStr | Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_full_unstemmed | Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_short | Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_sort | heat pipes in electronic packaging [tj264. s774 2007 f rb]. |
| topic | TJ255-265 Heat engines |
| url | http://eprints.usm.my/9052/ http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf |