Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].

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Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].

Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase...

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Bibliographic Details
Main Author:	Goh, Teck Joo
Format:	Thesis
Language:	English
Published:	2004
Subjects:	TK7800-8360 Electronics
Online Access:	http://eprints.usm.my/6319/ http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf

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