Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase...
| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2004
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| Subjects: | |
| Online Access: | http://eprints.usm.my/6319/ http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf |
| _version_ | 1848869962581540864 |
|---|---|
| author | Goh, Teck Joo |
| author_facet | Goh, Teck Joo |
| author_sort | Goh, Teck Joo |
| building | USM Institutional Repository |
| collection | Online Access |
| description | Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang
kepada peningkatan kadar penjanaan haba.
The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation. |
| first_indexed | 2025-11-15T15:16:37Z |
| format | Thesis |
| id | usm-6319 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T15:16:37Z |
| publishDate | 2004 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-63192013-07-13T03:25:03Z http://eprints.usm.my/6319/ Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607]. Goh, Teck Joo TK7800-8360 Electronics Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation. 2004-06 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf Goh, Teck Joo (2004) Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607]. PhD thesis, Universiti Sains Malaysia. |
| spellingShingle | TK7800-8360 Electronics Goh, Teck Joo Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607]. |
| title | Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
| title_full | Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
| title_fullStr | Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
| title_full_unstemmed | Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
| title_short | Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
| title_sort | thermal investigations of flip chip microelectronic package with non-uniform power distribution [tk7874. g614 2004 f rb]
[microfiche 7607]. |
| topic | TK7800-8360 Electronics |
| url | http://eprints.usm.my/6319/ http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf |