Goh, T. J. (2004). Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
Chicago Style (17th ed.) CitationGoh, Teck Joo. Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 F Rb] [Microfiche 7607]. 2004.
MLA (9th ed.) CitationGoh, Teck Joo. Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 F Rb] [Microfiche 7607]. 2004.
Warning: These citations may not always be 100% accurate.