APA (7th ed.) Citation

Oo, C. E. (2004). Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].

Chicago Style (17th ed.) Citation

Oo, Cheng Ee. Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 F Rb Kejuruteraan] [Microfiche 7715]. 2004.

MLA (9th ed.) Citation

Oo, Cheng Ee. Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 F Rb Kejuruteraan] [Microfiche 7715]. 2004.

Warning: These citations may not always be 100% accurate.